System
Operation
DryScrub® Systems use
an effluent reduction process rather than the effluent dilution process
employed by wet scrubbers. All spent reactive process gases exhausted from
the process tool pass through the DryScrub® reactor. The electrode within the DryScrub® reactor is
both the reactor and a collection chamber. This electrode consists of
multi-turn, high-conductance spirals or passageways that form the primary gas
flow path. These electrodes shape a uniform, high-intensity plasma through
which all effluent gases must pass.
The surface areas of these electrodes are >8M2 for the 2DX2 model, >4M2 for the standard 2D model and >2M2 for the 2DH model which all of them provide a
large surface area to plasma volume ratio in which the gasses are reacted to
depletion, the solids being deposited onto the electrode itself. As effluent
gases pass through the DryScrub electrode, they are
reacted to depletion.
A DryScrub® reactor is
installed in one of three possible vacuum-system
locations, determined by the process parameters.
Surface recombination reactors strip and deposit solid components of the
reacted gases on the electrode as solid dense films. As a result, mobile and
other submicron particles are essentially eliminated while chemically and
thermodynamically stable gases pass through the DryScrub® reactor for safer handling in downstream
equipment. Electrodes have predictable collection capacities and are replace during planned maintenance periods.
The design of DryScrub® Systems is elegant in its simplicity. It employs
the same basic CVD technology used in the production of many semiconductor
devices. It offers proven operating reliability and safe disposal of residual
waste.
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