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DryScrub, Electrochemical Technology Corporation (ETC) manufactures the patented DryScrub® plasma reactor system, also known as Plasma Trap. Installed between the process chamber and vacuum pump, which in situ abates and removes harmful constituents from the effluent gases of LPCVD, PECVD, MOCVD, ALD and etching systems. This is a true point of use exhaust abatement system. It is also an in-line process tool performance enhancement system. Processes for which it is effective include deposition of silicon nitride, TEOS, PSG and BPSG oxides; doped and undoped poly and amorphous silicons; blanket metals, metal nitrides, metal oxides, and metal silicides; MOCVD metals; ALD metals; GaAs; Al etching; PH3, AsH3, and PFC gases abatements and more. Improved Maintenance Procedures:
Improved Process and Equipment Operation:
Improved Safety and Environmental Impact:
Improved Bottom-Line Results:
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About ETC
© Copyright 2001 DryScrub ETC.
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Tel: +1-408-DryScrub |
(379-7278) |
+1-510-818-9333 |
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Toll Free: +1-888-DryScrub |
(379-7278) |
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Fax +1-510-818-9993 |
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(Sales Information) |